Sulfur Dioxide and Sulfolane Sodium Batteries

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Sulfur Dioxide and Sulfolane Sodium Batteries ( sulfur-dioxide-and-sulfolane-sodium-batteries )

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Batteries 2022, 8, 127 strate obtained after applying a potential of −0.2 V vs. Na+/Na for 500 s in the absence of and in the presence of the additive, respectively. It should be emphasized that the mor- phology of the sodium deposit dramatically changes upon the introduction of the addi- tive, from one formed by particles that easily detach from the substrate to a continuous and homogeneous sodium deposit on the entire Cu surface in contact with the electrolyte. 6 of 13 It is worth mentioning that this type of experimental result is not commonly reported in battery research, and it is novel in the context of sodium batteries. We would like to em- phasize that providing evidence on the quality and uniformity of the sodium deposit on research, and it is novel in the context of sodium batteries. We would like to emphasize that a macroscopic level is very important from practical and technical points of view. providing evidence on the quality and uniformity of the sodium deposit on a macroscopic Equivalent experiments have been carried out for the electrolytes 2 M level is very important from practical and technical points of view. −1 NaSCN/DOL:DME and 1 M NaClO4/PC under the same conditions (scan rate of 20 mV s Equivalent experiments have been carried out for the electrolytes 2 M NaSCN/DOL:DME and negative potential limit of −0.2 V). Figure 3a shows the CVs for the Na plating/stripping and 1 M NaClO4/PC under the same conditions (scan rate of 20 mV s−1 and negative process on Cu in 2 M NaSCN/DOL:DME without SO2 and for various mole fractions thereof. potential limit of −0.2 V). Figure 3a shows the CVs for the Na plating/stripping process The electrochemical plating of Na is clearly enhanced, even for low mole fractions of SO2 as onCuin2MNaSCN/DOL:DMEwithoutSO andforvariousmolefractionsthereof.The 2+ the additive significantly improves the Coulombic efficiency for the Na /Na process as well electrochemical plating of Na is clearly enhanced, even for low mole fractions of SO2 as the as the associated currents. It is remarkable, though, that, for SO2 mole fractions above 0.05, additive significantly improves the Coulombic efficiency for the Na+/Na process as well as the enhancement is less substantial. In any case, the additive again favors that sodium can the associated currents. It is remarkable, though, that, for SO2 mole fractions above 0.05, the be homogeneously deposited on the copper surface, as demonstrated through a comparison enhancement is less substantial. In any case, the additive again favors that sodium can be of the electrode photographs in Figure 3b,c. They were obtained after applying to the copper homogeneously deposited on the copper surface, as demonstrated through a comparison of electrode a potential of −0.2 V vs. Na+/Na for 500 s. the electrode photographs in Figure 3b,c. They were obtained after applying to the copper electrode a potential of −0.2 V vs. Na+/Na for 500 s. −1 Figure3.(a)CVsforthedepositionofNaonCuin2MNaSCN/DOL:DMEat20mVs −1fordifferent Figure 3. (a) CVs for the deposition of Na on Cu in 2 M NaSCN/DOL:DME at 20 mV s for different mole fractions of SO . Pictures (b,c) show the sodium deposit morphology on Cu before (b) and after mole fractions of SO2 2. Pictures (b,c) show the sodium deposit morphology on Cu before (b) and (acf)teard(dci)nagdadninSgOanmSOo2lemforalectfiroanctoiofn0.o1f00..1T0h.eTyhweyewreetraekteankeanftaefrtearpapplypilnyginag paoptoetnetniatilaolfof−−0..2V vs. 2 + Na /Naaffoorr55000ss.. Figure 4 shows the plating/stripping process for Na on Cu in 1 M NaClO /PC. In this Figure 4 shows the plating/stripping process for Na on Cu in 1 M NaClO4 4/PC. In this + case, and as expected, the Na +/Na process shows partial reversibility even in the absence case, and as expected, the Na /Na process shows partial reversibility even in the absence of SO . Interestingly, the current density increases with the concentration of the additive, of SO2. Interestingly, the current density increases with the concentration of the additive, contrary to what happened in the previous cases. Specifically, deposition currents more contrary to what happened in the previous cases. Specifically, deposition currents more thandoublewhenSO ispresentatamolefractionof0.20.Thisbehaviorisparalleltothat than double when SO22 is present at a mole fraction of 0.20. This behavior is parallel to that shown by the sodium metal electrodes (see Figure 1). The use of other metal substrates shown by the sodium metal electrodes (see Figure 1). The use of other metal substrates (aluminum in particular) is underway in our laboratories. (aluminum in particular) is underway in our laboratories.

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