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88 Handbook on the Physics and Chemistry of Rare Earths The chlorophosphate phosphor Sr5(PO4)3Cl:Eu2+ was synthesized by heat- ing a mixture of SrHPO4, SrCO3, SrCl2, and Eu2O3 at 1000–1200°C in a slightly reducing atmosphere (Kamiya and Mizuno, 2006). The fluorogerma- nate phosphor 3.5MgO0.5MgF2GeO2:Mn4+ was prepared by heating a mix- ture of MgO, MgF2, GeO2, and MnCO3 at 1100°C in air (Okamoto and Yamamoto, 2010). 6 IMPLEMENTING PHOSPHORS IN WHITE LED LAMPS This section deals with implementation of phosphors in LED lighting devices. Recent progresses, eg, remote phosphor and wafer-level packaging (WLP), are highlighted. 6.1 Conventional LED Packaging Typical components of a surface mount device (SMD) white-LED package are illustrated in Fig. 78. Phosphors are mixed in the encapsulant, a sealing resin—typically, silicone or an epoxy resin—that is topping a blue-emitting LED chip. Most encapsulants used for LEDs are thermosetting resins. The mixture of resin and phosphor is poured into LED packages using a dispenser and heated to harden the resin. 6.2 Improvements for Conventional Dispensing Process As described earlier, application of phosphor-containing resin into LED packages is usually conducted using a dispenser. However, it is difficult for common dispensers to pour a precisely constant volume of resin. As a result, the color coordinates of the LEDs may fluctuate. Improved processes have been proposed to overcome this drawback. An improvement of conventional dispensing process has been proposed that reduces the angular distributions of CCT by adjusting the slanting angle of the reflector cup of the package. In this way, the contact angle White light Encapsulant Phosphor InGaN LED Package FIG. 78 Typical components of a surface mount device (SMD) type white LED package.PDF Image | HANDBOOK ON THE PHYSICS AND CHEMISTRY OF RARE EARTHS
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