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ABSTRACT SUPERCRITICAL FLUID DEPOSITION OF THIN METAL FILMS: KINETICS, MECHANICS AND APPLICATION February 2009 CHRISTOS FOTIOS KARANIKAS, B.S., UNIVERSITY OF PITTSBURGH Ph.D., UNIVERSITY OF MASSACHUSETTS AMHERST Directed by: Professor James J. Watkins In order to meet the demands of the continuous scaling of electronic devices, new technologies have been developed over the years. As we approach the newest levels of miniaturization, current technologies, such as physical vapor deposition and chemical vapor deposition, are reaching a limitation in their ability to successfully fabricate nano sized electronic devices. Supercritical fluid deposition (SFD) is a demonstrated technology that provides excellent step coverage for the deposition of metals and metal oxides within narrow, high aspect ratio features. This technique shows the potential to satisfy the demands of integrated circuit miniaturization while maintaining a cost effective process needed to keep the technology competitive. In order to complement SFD technology heuristics for scale-up, an understanding of the deposition mechanism and kinetics and resolution of integration issues such as interfacial film adhesion must be resolved. It is critical to have a fundamental understanding of the chemistry behind the reaction process in supercritical fluid deposition. For this purpose, a detailed kinetic study of the deposition of ruthenium from bis(2,2,6,6-tetramethyl-3,5-heptanedionato) (1,5-cyclooctadiene) ruthenium(II) is carried out so that growth rate orders and a viiPDF Image | Supercritical Fluid Deposition Of Thin Metal Films
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