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mechanism can be established. These predictive kinetic results provide the means to control the reaction which allows for overall optimization of the process. Reliability is of the utmost importance for fabricated devices since they must withstand harsh steps in the fabrication process as well as perform and last under standard and extreme usage conditions. One issue of reliability is assessed by addressing the adhesion of the metallization layers deposited by SFD. A quantitative determination of the interfacial adhesion energy of as deposited and pretreated copper metallization layers from SFD onto barrier layers is used to determine the potential for integration of these films for industry standards. Extension of the basics of SFD by performing co-deposition of multiple compounds, layer-by-layer deposition for device fabrication and integration with other unique technologies for novel applications demonstrates the ability of this technique to satisfy a wide range of commercial applications and be used as the basis for new technologies. Co-depositions of Ce/Pt, Co/Pt, Ba/Ti and Nd/Ni for the fabrication of functional direct methanol fuel cell electrodes, magnetic alloys for media storage applications, high k dielectric films for alternative energy storage devices and alternative materials for solid oxide fuel cell cathodes, respectively, are performed. Layer-by-layer deposition with masking is used to fabricate nanometer scale capacitors. Finally, plasma spray technology is combined with the rapid expansion of supercritical solvents technique to form a novel, patent pending, process that is used to fabricate next generation photovoltaic cells. viiiPDF Image | Supercritical Fluid Deposition Of Thin Metal Films
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