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3.10: XPS sputter depth profile (top) and survey scan (bottom) of sample A-5, deposition side. No Cu layer is detected prior to the TaN region which confirms that the crack propagated at the desired interface ...............................................70 3.11: XPS sputter depth profile (top) and survey scan (bottom) of sample B-5, dummy side. The lack of presence by the TaN layer prior to the copper rich region confirms propagation of the crack at the desired interface..................................71 4.1: Schematic of hot wall reaction vessel ....................................................................80 4.2: Chemical structure of tris(2,2,6,6-tetramethyl-3,5-heptanedionato)cobalt (III), Co(tmhd)3, bis(cyclopentadienyls)cobalt (II), CoCp2, and dimethyl(1,5- cyclooctadiene)platinum (II), Pt(Me)2cod ...........................................................81 4.3: XPS sputter depth profile (top) and survey scan (bottom) showing a relatively constant ratio of Co:Pt throughout the bulk of the film for sample CoPt1 which is an SFD co-deposition of Co and Pt deposited at 150 oC in a hot wall reaction vessel ...................................................................................................................85 4.4: XPS sputter depth profile (top) and survey scan (bottom) showing a 2:1 ratio of Co:Pt for sample CoPt14 which is an SFD co-deposition of Co and Pt deposited at 60 oC in a hot wall reaction vessel...................................................................86 4.5: Top-down FE-SEM of sample CoPt2 showing a uniform coating of Co and Pt on the surface. Deposited via SFD in a hot wall reaction vessel at 150 oC.............87 4.6: Polyamide hot wall reaction vessel liner used during experiment CoPt11. The film seen is a pure Pt flim deposited at 60 oC via SFD .......................................87 4.7: XRD of sample CoPt11 showing a polycrystalline platinum film. Deposited in a hot wall reaction vessel via SFD at 60 oC ...........................................................88 4.8: XPS sputter depth profile (top) and survey scan (bottom) of sample CoPt11 showing a pure platinum film with little surface contamination and no contamination through the bulk of the film. Deposited in a hot wall reaction vessel via SFD at 60 oC .......................................................................................89 4.9: Chemical structure of Tetrakis(2,2,6,6-tetramethyl-3,5-heptanedionato)cerium (IV), Ce(tmhd)4....................................................................................................93 4.10: Top-down FE-SEM of sample TaN08 showing a conformal coating of Ce and Pt on the TaN capped substrate. Deposited via SFD in a hot wall reaction vessel at 150 oC ..................................................................................................................97 xixPDF Image | Supercritical Fluid Deposition Of Thin Metal Films
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