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1.1 Overview CHAPTER 1 INTRODUCTION The goal of the research presented in this dissertation is to help advance supercritical fluid deposition technology from its current state of being a demonstrated laboratory technology, to a point where it is a viable manufacturing option for the miniaturization of integrated circuits in industry. The challenges that must be overcome in order to meet this goal include scale-up and reliability testing. Scale-up is necessary in order to convert a bench top result into a practical application for industrial use. To do this, it is critical to have a fundamental understanding of the chemistry behind the reaction process in supercritical fluid deposition. For this purpose, a detailed kinetic study of the deposition is carried out such that growth rate orders and a mechanism can be established. This will help enable control over the reaction by promoting predictive kinetic results and will also allow for an overall optimization of the process. Reliability is of the utmost importance for fabricated devices if they are to withstand the upcoming harsh steps in the fabrication process as well as perform and last under standard and extreme usage conditions. The challenge of reliability is accessed by addressing the adhesion of the metallization layers deposited by SFD. A quantitative determination of the interfacial adhesion energy of as deposited and pretreated metallization layers from SFD onto barrier layers is used to determine the reliability of these films for industry standards. 1PDF Image | Supercritical Fluid Deposition Of Thin Metal Films
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