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Supercritical Fluid Deposition Of Thin Metal Films

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Supercritical Fluid Deposition Of Thin Metal Films ( supercritical-fluid-deposition-of-thin-metal-films )

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Application of SFD technology to a variety of commercially oriented applications is important in order to show the techniques versatility. Extension of the basics of SFD by performing co-deposition of multiple compounds, layer-by-layer deposition for device fabrication and integration with other unique technologies for novel applications demonstrates the ability of this technique to satisfy a wide range of commercial applications and be used as the basis for new technologies. In this first chapter, conventional deposition techniques are discussed. Supercritical fluid deposition is then discussed in detail and compared to the conventional deposition techniques. An overview of the common instruments used for post experimental analysis is discussed with a description of the settings used for most data collection. Chapter 2 details the experiments involved with the kinetic study used to satisfy the first challenge of scale-up. This chapter discusses the kinetics of ruthenium thin film deposition by supercritical fluids using bis(2,2,6,6-tetramethyl-heptane-3,5-dionato)(1,5- cyclooctadiene) ruthenium(II), Ru(tmhd)2cod, as the precursor. Reaction rate orders are determined and a Langmuir – Hinshelwood deposition mechanism is proposed. Chapter 3 is a detailed discussion based on the experiments used to satisfy the challenge of reliability. The chapter discusses the mechanics study used to quantify the interfacial adhesion of poly(acrylic acid) modified and unmodified copper thin films deposited on TaN capped silicon wafers by the hydrogen assisted reduction of bis(2,2,7- trimethyloctane-3,5-dionato) copper in supercritical carbon dioxide. Chapter 4 and Chapter 5 are examples of applications in which SFD technology is used to mimic, better or create new applications that have commercial interest. 2

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