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limitation in their abilities to successfully fabricate the nano sized electronic devices. The inability of conventional top-down device fabrication to satisfy the miniaturization of integrated circuits is forcing industry to a new method of fabrication called bottom-up fabrication. However, the majority of electronic devices are still fabricated using the top- down method. Conventional deposition technique such as physical vapor deposition (PVD), atomic layer deposition (ALD) and chemical vapor deposition (CVD) suffer from a few critical flaws that prevent them from meeting the needs of miniaturization in top-down fabrication. The primary limitations of these techniques are the efficiency, both speed and cost, at which films can be deposited, the ability to deposit conformal films in high aspect ratio features and the adhesion of the deposited films to the integrated circuits for post processing steps. Supercritical fluid deposition is a demonstrated technology that has overcome the limitations of these conventional techniques. This technique shows unique potential to satisfy all the demands of integrated circuit miniaturization while maintaining a cost effective process needed to keep the technology competitive. 1.3 Conventional Deposition Techniques The most common conventional deposition techniques are electroplating, electroless plating, PVD, ALD and CVD. Electro and Electroless plating are liquid phase techniques while PVD, ALD and CVD are gas phase techniques. 5PDF Image | Supercritical Fluid Deposition Of Thin Metal Films
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