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1.3.1 Electroplating Electroplating is a process that uses a liquid solution to transport metal ions from an anode to a cathode. The item to be plated is attached to the anode of a direct current source, typically a battery, while the metal source is connected to the anode. Both the anode and cathode are placed into a solution which promotes the flow of electricity, usually done by adding metal salts to the solution. When the current source is switched on, the metal attached to the anode is oxidized to form cations which in turn associate with the anions in solution. They are then reduced, and therefore plated, on the cathode. This process can be used to deposit films that are very conformal. However, this process produces a large amount of waste and also requires that the anode and cathode are conductive. For non conductive materials, it is necessary to deposit a seed layer in order to make the material conductive. This, however, becomes problematic for interconnect structures as conformal seed layers are necessary. Given the complex geometry, which results in challenging seed layer depositions and an extra step in the fabrication process of electronics, it is desirable to seek other options that can alleviate these issues. 1.3.2 Electroless Plating Similar in nature to the electroplating process, this process produces the same result, plating of an object, however without the use of a current source. This process typically requires the use of toxic reducing agents in the aqueous solution, resulting in large amounts of hazardous waste. Additionally, a conductive seed layer is required for this autocatalytic process if the item to be coated is not conductive. 6PDF Image | Supercritical Fluid Deposition Of Thin Metal Films
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