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With both electroplating and electroless plating, high precursor concentrations can be achieved due to the liquid phase of the system. However, slow mass transport in the fluid phase and large volumes of waste water and byproducts negatively impact these processes. 1.3.3 Physical Vapor Deposition Physical Vapor Deposition (PVD) is a process that uses thermodynamic or mechanical means to produce a solid thin film, typically in a low-pressure environment. Evaporation is the oldest technique for the physical deposition of thin films, such as Au and Al. Metals, such as these, are heated to the point of vaporization and then evaporate and form a thin film covering the substrate of interest. This technique is performed under vacuum, which allows the composition of the material being deposited to be controlled. The mean free path of the deposited molecule is typically on the order of 10 m. This means that the molecules do not interact with background gases and collide with the substrate in a linear path from the target. This only allows for a line of sight deposition, also known as shadowing, which limits its use to planar substrates and low aspect ratio structures. In addition, creating thick films is problematic due to the limited size of targets as constrained by the limitations imposed by heat transfer of the heating filaments. Regardless, this uses the target in one of the most efficient methods for deposition. Sputtering, a more popular PVD technique, occurs when a target is bombarded with energetic ions, typically Ar+. The atoms at the surface of the target are dislodged and then transported to the substrate, where the deposition occurs. The heat generated by this process can cause substrate temperatures of nearly 900 °C, which can cause 7PDF Image | Supercritical Fluid Deposition Of Thin Metal Films
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