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sites with which the deposited film can bond with the previous layer. Copper is easily oxidized in the presence of oxygen in very small quantities. Therefore, for the reduction of precursors for copper deposition, it is advantageous to work in an inert atmosphere. In SFD, a high density CO2 atmosphere is used which drastically reduces the potential for copper oxidation thereby giving way to greater adhesion. There are multiple approaches that have been used toward the end goal of increasing adhesion between copper and its barrier layer. Self-assembled molecular nanolayers (MNLs) have been employed in order to increase adhesion from the angle of improving interfacial bonding. 3-mercapto-propyl-tri-methyoxy-silane (MPTMS) MNLs have been used for PVD deposited Cu/SiO2 interfaces resulting in a threefold increase in adhesion.13-15 Mutli-layers of vinyl silane monomers were cross-linked to form C-Si films which increase adhesion.16, 17 Poly(dimethylsiloxane) was used to cold weld gold contacts together at ambient conditions.18 Unfortunately, these MNLs have low stability at temperatures exceeding 400 oC due to desorption or degradation. Ramanath et al. recently reported the use of the same MPTMS’s previously reported, however with the improvement of stability at temperatures exceeding the MNL’s desorption temperature.19 Additional methods for increasing adhesion by improving interfacial bonding include the alloying of other metals, such as aluminum, magnesium and ruthenium to copper.20-27 Even though these alloyed metals show two- and threefold increases in adhesion, they are currently not used in industry. Taking advantage of the relatively inert environment of supercritical carbon dioxide used during SFD, Zong et al. reported the use of ultrathin layers of poly(acrylic acid) (PAA)on diffusion barrier layers of TiN, Ta and TaN to dramatically increase the 56PDF Image | Supercritical Fluid Deposition Of Thin Metal Films
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