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adhesion of copper films to these barrier layers by preventing interfacial oxidation through the hydrogen assisted reduction of bis(2,2,7-trimethyloctane-3,5-dionato) copper.28 The pretreatment of the silicon substrates with PAA was performed by either spin coating of PAA or vapor phase exposure of PAA. Additionally, it was suggested that this method be extended to more complex substrates by the adsorption of acrylic acid to the substrate and subsequent thermal or UV polymerization to PAA to achieve the same pretreatment effect. Post copper deposition XPS indicated that there was no PAA layer at the copper/barrier interface, which indicates that the PAA layer was completely sacrificial at the reaction conditions used. The increased adhesion was attributed to the reduction of oxides at the interface due to the presence and subsequent degradation of the PAA layer at the interface. Within the microelectronics industry, there exists a need for a standard quantitative method of measuring adhesion. It will then be possible to fully understand the mechanisms of adhesion, which will make it possible to fully exploit the potential of thin films for this critical application. Due to this need, a wide range of measurements have been developed. However, the majority of these (scribed tape test, scratch test, peel test and many others29-36) are qualitative since they only allow for visual comparison for quality control purposes. Therefore, the results of these numerous tests make it impossible to compare material properties outside of individual tests. If tests are more quantitative, then a direct comparison of critical energies can be made and understanding the energy dissipative mechanisms of interfacial adhesion would be possible. Typical tests including micro indentation, the pull-off test, the blister test, the edge-delamination test and the four-point bend test are all quantitative measurements.37-42 57PDF Image | Supercritical Fluid Deposition Of Thin Metal Films
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