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Supercritical Fluid Deposition Of Thin Metal Films

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Supercritical Fluid Deposition Of Thin Metal Films ( supercritical-fluid-deposition-of-thin-metal-films )

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Unfortunately, the majority of these are designed for macro scale films. A few, however, can be extended to thin film adhesion; of these, some still suffer further from difficult sample preparation methods. However, over the recent years, four-point bend has emerged as the industry standard method of quantitatively measuring thin film adhesion.43-54 The four-point bending method is the method of choice not necessarily because sample preparation is easier, but because the experimental data is relatively easier to interpret. This is primarily because of two reasons, the first being that the method is based on established fracture mechanics, and the second being that the film is bonded to one substrate in the crack wake and consequently the residual stress in the film is not relieved to contribute to the crack driving force (energy release rate). 3.2 Experimental 3.2.1 Equipment 3.2.1.1 Cold Wall Reactor The deposition of copper is carried out in a cold wall reactor, Figure 1. The reactor consists of two opposed 316 stainless steel flanges sealed with a 2-236 Buna-N o- ring. The internal volume of the reactor is approximately 70 cm3. A custom designed 2.3” diameter aluminum sample stage, Appendix B, with 450 W coiled resistive heater (Belilove Company Engineers, Hayward, CA) is installed at the bottom of the reactor with a high pressure sealing split gland fitting (Conax Buffalo Corp, Buffalo, NY). The wall of the stainless steel reactor is heated using four 3” long, 120 V, 170 W cartridge heaters and is maintained at a lower temperature than the reaction stage in order to induce selective deposition to the higher temperature sample stage. The heated sample stage and 58

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