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Untreated Figure 3.3: Experimental sample stack for mechanical adhesion testing of copper deposited film on unmodified TaN capped substrates. Si, SiO2, Epoxy, TaN thicknesses are approximately 700-750 μm, 500 nm, 5 μm and 30 nm, respectively. Cu thickness varies according to Table 3.1. Treated Si SiO2 Epoxy Cu TaN TaN Si Si Si SiO2 Epoxy Cu Sacrificial PAA TaN TaN Si Si Figure 3.4: Experimental sample stack for mechanical adhesion testing of copper deposited film on poly(acrylic acid) modified TaN capped substrates. PAA thickness approximately 15 nm. 3.2.3.4 Mechanical Testing The delamination experiments to determine the adhesion energy of the Cu/TaN interface are performed using the four-point bending technique, Figure 5. All samples are tested at 21 ± 0.3 oC in an environmental cell with N2 flow, relative humidity below 10 %, immediately after the samples are cured. Before formal testing, a three-hour stabilizing period is allowed to achieve thermal equilibrium and minimize thermal fluctuation during test. The default loading rate, crosshead speed, is 0.1 μm/s. Four-point 64PDF Image | Supercritical Fluid Deposition Of Thin Metal Films
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