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100 90 80 70 N1s 60 50 40 Si2p c/s Atomic Concentration (%) -O KLL -Ta4p1 -Ta4p3 -C1s -Ta4d3 -Ta4d5 -Ta4f -O1s 30 20 10 Ta4f O1s C1s Cu2p 00 5 10 15 20 25 30 6 x 104 5 4 3 2 1 0 1000 900 800 700 600 500 400 300 200 100 0 Sputter Time (min) Binding Energy (eV) Figure 3.10: XPS sputter depth profile (top) and survey scan (bottom) of sample A- 5, deposition side. No Cu layer is detected prior to the TaN region which confirms that the crack propagated at the desired interface. 70PDF Image | Supercritical Fluid Deposition Of Thin Metal Films
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