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100 90 80 70 60 50 40 30 20 10 00 10 20 30 40 50 60 14 x104 12 10 8 6 4 2 01000 900 800 700 600 500 400 300 200 100 0 Cu2p C1s Sputter Time (min) -Ta4p1 -Ta4p3 -Cu LMM1 -Cu LMM -Ta4s -C1s -Ta4d5 -Ta4d3-Ta4d -Cu3p -O2s-Ta4f c/s Atomic Concentration (%) -O KLL -Cu2p1 -Cu2p3 -Cu LMM3 -Cu LMM2 Binding Energy (eV) Figure 3.11: XPS sputter depth profile (top) and survey scan (bottom) of sample B- 5, dummy side. The lack of presence by the TaN layer prior to the copper rich region confirms propagation of the crack at the desired interface. 71PDF Image | Supercritical Fluid Deposition Of Thin Metal Films
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