Supercritical Fluid Deposition Of Thin Metal Films

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Supercritical Fluid Deposition Of Thin Metal Films ( supercritical-fluid-deposition-of-thin-metal-films )

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3.4 Discussion PAA is used at the Cu/TaN interface to maintain an oxide and contamination free interface during SFD deposition of copper. PAA, at the reaction conditions used, will degrade and is ultimately sacrificial, as seen in the XPS sputter depth profiles in Figure 10 and 11. Along with its decomposition products, PAA, a weak acid (pKa = 4.28), acts as an etching agent to clean the surface of any oxides or ligand contamination that are formed or left behind during the reduction reaction. A comparison of the adhesion energy of untreated stacks vs PAA pretreated stacks indicates that there is a 5 fold increase in adhesion energy of the Cu/TaN interface when pretreated with a 15 nm thick layer of spun on PAA from a 1 % PAA in water solution. This increase in adhesion energy allows copper deposited by SFD to meet industry standards. Interfaces with an adhesion energy of less than 5 J/m2 exhibit delamination or cracking during chemical mechanical polishing (CMP) and for this reason, 5 J/m2 is the adhesion energy required in the semiconductor industry.49 It is important to note that in Figure 10 and 11, there is a slight carbon count at the beginning of each sputter depth profile for one cycle; this is attributed to contamination from the air after mechanical testing and not the presence of the PAA layer. Although film thickness is known to affect adhesion energy as a result of plasticity in the film, this is only common for relatively thicker films than studied here. Sensitivity for changes in energy is a function of, in this case, the load cell used. There is no obvious trend in adhesion energy as a function of film thickness in either the untreated or PAA pretreated stacks. 72

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