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Given that the cobalt concentration is so low, it is likely that the tmhd etched away the cobalt that is deposited. 60 50 40 Co2p 20 Pt4f 10 Ta4f N1s 30 00 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 Sputter Time (min) 10000 9000 8000 7000 6000 5000 4000 3000 2000 1000 0 1000 900 800 700 600 500 Binding Energy (eV) 200 100 0 -Co3s -Co3p -Pt4f7 -Pt4f5 -Pt4f -O2s c/s Atomic Concentration (%) -C1s -Pt4p3 -O1s -O KLL -Co LMM2 -Co2p3 -Co2p -Co2p1 -Co LMM -Pt4d3 -Pt4d5 Figure 4.3: XPS sputter depth profile (top) and survey scan (bottom) showing a relatively constant ratio of Co:Pt throughout the bulk of the film for sample CoPt1 which is an SFD co-deposition of Co and Pt deposited at 150 oC in a hot wall reaction vessel. 85 400 300PDF Image | Supercritical Fluid Deposition Of Thin Metal Films
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