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45 40 35 30 25 20 15 10 Ta4f 5 00 0.5 1 1.5 2 2.5 3 Sputter Time (min) O1s Co2p Pt4f N1s 2x104 1.8 1.6 1.4 1.2 1 0.8 0.6 0.4 0.2 0 1000 900 800 700 600 Binding Energy (eV) 200 100 0 -Pt4f7 -Pt4f5 -Ta4f c/s Atomic Concentration (%) -Pt4p3 -O1s -Ta4p3 -Pt4d3 -Pt4d5 -C1s -Ta4d 3-Ta4d 5 -Co LMM -Co2p3 Figure 4.4: XPS sputter depth profile (top) and survey scan (bottom) showing a 2:1 ratio of Co:Pt for sample CoPt14 which is an SFD co-deposition of Co and Pt deposited at 60 oC in a hot wall reaction vessel. 86 500 400 300PDF Image | Supercritical Fluid Deposition Of Thin Metal Films
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