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conformal deposition across the entire film are necessary in order to eliminate component failure. For this reason, the titania dielectric layer for a nano-sized capacitor is no longer being pursued. 70 60 50 40 30 20 10 00 5 10 15 20 25 Sputter Time (min) Figure 4.26: XPS sputter depth profile of a Ru/TiO2/Ru stack confirming all components of the stack. However, layer definition is lost with increased sputter cycles (moving from top of the stack towards the substrate). Ru3d O1s Si2p Ti2p 124 Atomic Concentration (%)PDF Image | Supercritical Fluid Deposition Of Thin Metal Films
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