Supercritical Fluid Deposition Of Thin Metal Films

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Supercritical Fluid Deposition Of Thin Metal Films ( supercritical-fluid-deposition-of-thin-metal-films )

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6.2 Future Work 6.2.1 Kinetics The kinetics of SFD are now established for metal deposition via a copper SFD kinetics study and the ruthenium kinetics study detailed here. Further understanding of the deposition of metal oxides via hydrolysis reactions is currently under investigation. With the current level of understanding of the deposition kinetics for SFD reactions, many well educated guesses could be made about the variety of techniques that are discussed in Chapter 4. However, kinetic studies are essential to confirm them. Additional studies are needed to understand the interaction of multiple precursor systems during co-deposition reactions in supercritical fluids. Other works include understanding the kinetics of film formation from other supercritical solvents, such as the water/ethanol system studied for BaTiO3 film formation. Finally, understanding more complex ligand systems for single precursor SFD reactions lends itself to better predicting the results of new systems without having to perform tedious kinetic studies. 6.2.2 Adhesion Enhancement and Mechanical Testing The results of this study indicate that copper metallization layers have increased adhesion on TaN barrier layers. However, dependency on the metallization layer type and the substrate type are uncertain. In order to establish this important piece of information, an additional adhesion studies should be performed. First, a study on other barriers layers, such as TiN, should be performed. Next, a study using other metals should also be performed. This will establish whether or not there is a dependency on the 176

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