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HEAT EXCHANGER USING NANO FLUID

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HEAT EXCHANGER USING NANO FLUID ( heat-exchanger-using-nano-fluid )

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Mehta et al., International Journal of Advanced Engineering Technology E-ISSN 0976-3945 fluid constituents can be taken up as future work. 4. The research work can be extended by considering the effect of thickness of the twisted tape inserts. 6. CONCLUSION By using the knowledge of making nano fluid and we get from literature review we are going to design and develop a Heat Exchanger by using nanofluids. We are also using design software to design heat exchanger. REFERENCES 1. Keblinst.P, Eastman.J.A and Cahill.D.G,”Nano fluids for Thermal Transport” Materials Today, 8 (2005), 6, pp. 36-44. 2. Eastman J.A, Choi S.U.S, Li. S, Yu.W and Thompson L.J.”Anomalously increased Effective thermal conductivities of ethylene glycol-based nanofluids conducting copper nanoparticles.”Applied Physics Letters. 78(2001), 6, pp. 718-720. 3. Das. S.K. Putra.N and Roetzel .W. “Pool Boiling Characteristics of Nano fluids”. International Journal of Heat and Mass transfer, 46 (2003), 5, pp. 851-862. 4. Eastman.J.A,Cho.S.U.S,Li.S and Thompson.L.J, and Dimelfi.R.J,”Thermal properties of Nano structured materials”, Journal of Metastable Nano Crystalline Materials, 2 (1998), pp. 629 – 637. 5. Tran.P.X and Soong.Y, “Preparation of nanofluids using laser ablation in liquid technique”, ASME Applied Mechanics and Material Conference, Austin, TX – 2007. 6. Patel.H.E, Das.S.K, Sundarrajan.T, Sreekumaran Nair.A, George.B and Pradeep.T, “Thermalconductivities of naked and manolayer protected metal nanoparticle based Nanofluids, Manifestation of anomalous enhancement and chemical effects”, Applied Physics Letters, 83(2003), 14, pp. 2931 – 2933. 7. Zhu.H, Lin.Y and Yin.Y, “A novel one step chemical method for preparation of copper Nanofluids”, Journal of Colloid and Interface Science, 277 (2004), 1, pp. 100 – 103. 8. Yu W, France DM, Routbort JL, Choi SUS: Review and comparison of nanofluid thermal conductivity and heat transfer enhancements. Heat Transfer Eng 2008, 29:432-460. 9. D.B.Tuckerman and R.F.W.Pease “High performance heat sinking for VLSI” IEEE electron device letter. Vol2, Number 5, 1981, pp 126-129 10. X. W. Wang, X. F. Xu and S. UConductivity of Nanoparticle-Fluid mixture,“ Journal of Thermophysics and Heat Transfer, Vol. 13, No. 4, 1999, pp. 474-480. 11. S. Lee, S. U. S. Choi, S. Li and J. A. Estman, “Measuring Thermal Conductivity of fluid containing Oxide Nanoparticles,” Journal of Heat Transfer, Vol. 121, No. 2, 1999, pp. 280-289. 12. B.-X.Wang, L.-P.Zhou and X.-F. Peng, “A Fractal Model for Predicting the Effective Thermal Conductivity Liquid with Suspension of Nanoparticles, ”International Journal of Heat and Mass Transfer, Vol. 46, No. 14, 2003, pp. 2665-2672. 13. J. Koo and C. Kleinstreuer, “A New Thermal Conductivity Model for Nanofluids,” Journal of Nanoparticle Resea Vol. 6, No. 6, 2004, pp. 577-588 14. Q. Li and Y. M. Xuan, “Convective Heat transfer and Flow Characteristics of Cu -Water nanofluid,’’ science in China Series E: Technological Sciences, Vol. 45, No. 4, 2002, pp. 408-416. 15. Y. M. Xuan and Q. Li, “Investigation on Convective Heat Transfer and Flow Feartures of Nanofluids,’’ Journal of Heat Transfer, Vol. 125, No. 1, 2003, pp. 151-155 16. B. C. Pak and Y. I. Cho, “Hydrodynamic and Heat Transfer Study of Dispersed Fluids with Submicron Metallic Oxide Particles,” Experimental Heat Transfer, Vol. 11, No. 2, 1998, pp. 151- 170. 17. D. S. Wen and Y. L. Ding, “Experimental Investigation into Convective Heat Transfer of Nanofluids at the Entrance Region under Laminar Flow Conditions,” International Journal of Heat and Mass Transfer, Vol. 47, No. 24, 2004, pp. 5181-5188. 18. S. P. Jang and S. U. S. Choi, “ Cooling Performance of a Microchannel Heat Sink with Nanofluids,” Applied Thermal Engineering, Vol. 26, No. 17-18, 2006, pp. 2457-2463. 19. T.-H. Tsai and R. Chein, “Performance Analysis of Nano-fluid-Cooled Microchannel Heat Sinks,” Internantional Journal of Heat and Fluid Flow, Vol. 28, No. 5, 2007, pp. 1013-1026. 20. J. Lee and I. Mudawar, “Assessment of the Effectiveness of Nanofluids for Single-Phase and Two- Phase Heat Transfer in Micro-Channels,” International Journal ofHeat and Mass Transfer, Vol. 50, No. 3-4, 2007, pp. 452-463 21. M. I. Hasan, A. A. Rageb, M. Yaghoubi and H. Homayony, “Influence of Channel Geometry on the Performance of Counter Flow Microchannel Heat Exchanger,” International Journal of Thermal Sciences, Vol. 48, No. 8, 2009, pp. 1607-1618. 22. Reay, D.A., Compact heat exchangers, enhancement and heat pump, International Journal of Refrigeration, vol. 25, 2002, pp.460-470. 23. Kays, W.H. & London, A.L, Compact Heat Exchangers, 3rd edition, 1984, McGrawHil. 24. Shah, R.K., Sekulic, D.P., Fundamentals of Heat Exchanger Design, 1st Edition, 2003, John Wiley & Sons.Inc. 25. Vasu, V., Rama, K.K., Kumar, A.C.S., Analytical prediction of forced convective heat transfer of fluids embedded with nanostructured materials (nanofluids), Pramana – Journal of Physics, Vol.69, no.3, 2007, pp.411- 421. 26. Vasu, V., Rama, K.K., Kumar, A.C.S., Empirical Correlations to predict thermophysical and heat transfer characteristics of Nanofluids, Thermal Science Journal, vol.12, no.3, 2008. 27. Shah, R.K., Sekulic, D.P., Fundamentals of Heat Exchanger Design, 1st Edition, 2003, John Wiley & Sons.Inc. 28. Journal of Electronics Cooling and Thermal Control, 2012, 2, 35-43 IJAET/Vol.III/ Issue IV/Oct.-Dec., 2012/49-54

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