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Solar Energy Technologies Program

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Solar Energy Technologies Program ( solar-energy-technologies-program )

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Interconnects (Tier-2 TIO) • Pursue innovations to improve manufacturability of cells and interconnects. Packaging (Tier-2 TIO) • Pursue innovations to reduce optical losses. • Develop encapsulation materials that reduce module cost and maintain reliability. • Continue to refine accelerated life testing that predictably replicates failures seen in the field. Manufacturing (Tier-2 TIO) • Maintain current partnerships, and form new ones, to accelerate the implementation of R&D progress into commercially available products. • Implement fully the Science and Technology Facility (S&TF) tool suites to facilitate laboratory/industry interaction in developing manufacturing technologies and accelerating technology transfer to industry. • Develop and implement in-line diagnostics. The c-Si Project will coordinate these activities while strengthening collaborations between DOE laboratories, universities, and industry. To ensure this interaction, the c-Si Project has formed an external working group composed of industry and university leaders in c-Si R&D. The working group will assemble to exchange the latest information and R&D results, while informing the c-Si Project on desired future directions. Thin Films. The technical aspects of the plan for thin-film R&D focus on the three key TIO metrics: module efficiency, module area cost, and module reliability. As in c-Si, efforts to address these metrics will be conducted both at the laboratories and through subcontracted R&D with universities (including DOE’s University of Excellence in Thin Films) and the PV industry. Internal laboratory efforts will focus on the absorber and cells/contacts Tier 2 TIOs, while subcontracted R&D will cover the full range of Tier 2 TIOs—absorbers, cells/contacts, interconnects, packaging, and manufacturing. Internal and external efforts will be led and coordinated by the Solar Program’s Thin-Film PV Partnership and the PV Manufacturing R&D Project. Examples of specific, key activities to address thin-film performance, cost, and reliability are shown below. Absorber (Tier-2 TIO) • Reduce semiconductor layer thicknesses and increase photon absorption, reduce feedstock consumption, and decrease energy input and capital costs. Cell and Contact (Tier-2 TIO) • Develop novel cell structures and processes to improve cell performance at lower potential manufacturing costs. • Engage in efforts to transfer laboratory cell performance to production modules. Interconnects (Tier-2 TIO) • Pursue innovations in module design leading to reduced active-area losses through edge and interconnect scribes. Packaging (Tier-2 TIO) • Develop technology-specific accelerated life tests that accurately replicate observed field failures. • Develop and evaluate lower-cost, more-reliable packaging materials. 52

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