CO2 RECOVERY PROCESS FOR SUPERCRITICAL EXTRACTION

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CO2 RECOVERY PROCESS FOR SUPERCRITICAL EXTRACTION ( co2-recovery-process-for-supercritical-extraction )

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US 6,960,242B2 34 processstreamcontainingpressurizedliquidcarbondioxide, extraction process Waste and optionally at least one co-solvent, comprising means for reducing the pressure of the liquid carbon dioxide; and a vent for passing loW pressure carbon dioxide vapor resulting from the pressure reduction to exhaust; characteriZed by further comprising: a separator for forming the process stream into tWo phases comprising a process liquid, containing co-solvent if present, and a process vapor phase stream; a vent for passing loW pressure carbon dioxide vapor resultingfromthepressurereductiontoexhaust; a separator for forming the process stream into tWo phases comprising a process liquid, containing co-solvent if present, and a process vapor phase stream; a container for collecting the process liquid; at least one ?lter to remove particulates and optionally residual co-solvent from the process vapor phase stream; an adsorber to remove trace impurities from the ?ltered process vapor stream to form a puri?ed carbon dioxide vapor stream; at least one dryer to remove residual Water vapor from the puri?ed carbon dioxide vapor stream; a How netWork having conduits connecting the compo nents of the apparatus; theconduitsofsaidHow netWorkincludingavaporvent line from the loW pressure accumulation vessel to the condensertofacilitateintroductionoftheintermediateliquid carbon dioxide stream into the loW pressure accumulation vessel; the conduits of the How netWork including a connection betWeen the at least one dryer and the at least one purifying ?lter upstream from the ?rst condenser; and, the How netWork having valves associated With said conduits to alloW for isolation of components of the appa ratus. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic vieW of an apparatus for carrying out a supercritical extraction and recovery process. DETAILED DESCRIPTION Althoughthesubjectapparatusandprocessareapplicable to many processes for making industrial products Which must be cleaned during or after production, for convenience theapparatusandprocessWillbeexempli?edWithrespectto 10 an adsorber to remove trace impurities from the ?ltered process vapor stream to form a puri?ed carbon dioxide 15 vapor stream; at least one dryer to remove residual Water vapor from the puri?ed carbon dioxide vapor stream; a How netWork having conduits connecting the compo nents of the apparatus; the conduits of the How netWork including a connection betWeen the at least one dryer and a condenser associated With a supply of carbon dioxide to the extraction process; and, the How netWork having valves associated With said 25 conduits to alloW for isolation of components of the appa ratus. In certain embodiments, the separator is a second con denser for cooling the process stream to form the tWo phases. In certain embodiments, the adsorber is a plurality of adsorber beds. In certain embodiments, at least one con denser includes an external refrigeration circuit having a heat exchanger to condense the puri?ed carbon dioxide vapor feed stream through indirect heat exchange With a 35 refrigerant stream. In certain of those embodiments, a con duit is provided betWeen the refrigeration circuit and the adsorber to permit used refrigerant to ?ush out at least one adsorber bed When isolated from the apparatus. a container for collecting the process liquid; at least one ?lter to remove particulates and optionally residual co-solvent from the process vapor phase stream; Inanotherembodiment,anapparatusisprovidedforthe40 theiruseinconnectionWithsemiconductorWaferprocess supply and recovery of carbon dioxide for a supercritical extraction process comprising: a bulk liquid carbon dioxide supply tank for distilling off a feed stream comprising carbon dioxide vapor; ing. According to a process for cleaning an industrial product, such as a semiconductor Wafer, With supercritical carbon dioxide (SCCO2) and a co-solvent, and recovering the carbon dioxide (CO2) for recycle, an apparatus and atleastonepurifying?ltertoremovecondensablevapors 45 processareprovidedincludingintroducingafeedstream and particulates from the carbon dioxide vapor feed stream; a ?rst condenser for condensing the carbon dioxide vapor feed stream into an intermediate liquid carbon dioxide stream; a loW pressure accumulation vessel for accumulating the intermediate liquid carbon dioxide stream; at least one particle ?lter to remove particulates from the intermediate liquid carbon dioxide stream; means for pressuriZing the intermediate liquid carbon dioxide stream to form a pressuriZed liquid carbon dioxide stream; a high-pressure accumulation vessel for accepting the pressuriZed liquid carbon dioxide stream; asupercriticalextractionapparatusforreceivingthepres suriZed liquid carbon dioxide stream and optionally a co-solvent, for carrying out the supercritical extraction and providing a process stream comprising pressuriZed liquid carbon dioxide, extraction process Waste and optionally the atleastoneco-solvent; means for reducing the pressure of the liquid carbon dioxide; comprisingcarbondioxidevaporintoapurifying?lter,such as for carrying out gas phase puri?cation; condensing the puri?ed CO2 stream, such as by use of mechanical refrig eration or cryogenic refrigerants, and compressing and heat ing the puri?ed CO2 to achieve the supercritical state. Afterthehighpurity,supercriticalCO2 streamhasgone through the Wafer production process, the supercritical Waste stream (Which may contain co-solvent and impurities removed from the Wafers) is depressuriZed and cooled such as by using mechanical or cryogenic refrigerants to form a tWo-phasemixture,Withthemajorityoftheimpuritiesbeing in the liquid phase. The phase separation results in a vapor phase that contains primarily CO2 With trace amounts of impurities.Thevaporphaseispassedthroughanadsorption systemsuchthatthetraceimpuritiesareremoved.The noW puri?edCO2 streamiscooledtoatemperaturesuchthatthe CO2 is entirely condensed, and the puri?ed liquid CO2 is returned to a storage tank or loW pressure accumulator. The goal for Wafer cleaning is to remove all surface 65 contaminantsorresidue,suchasparticles,organics,metal licsandnativeoxides.ThroughoutcertainWaferfabrication processes, it is estimated that the surface of an individual

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