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Annual Review of Heat Transfer, Vol. 15, p.131-177 https://doi.org/10.1615/AnnualRevHeatTransfer.2012004651 Figure 16: Pipe segment with capsules filled with PCM (macro-encapsulation) Another concept with extended heat transfer surface utilizes additional conductive structures to enhance heat transfer. The concept aims to reduce the distances for heat transfer in the low conductive PCM. Examples of structures include fins, foams, meshes, wires and fibers. Dispersed conductive particles show a low interconnection. Hence, they provide a less effective heat transfer path compared to interconnected structures, if the same structure volume is assumed. Design criteria of conductive structures to enhance heat transfer include the following: Compatibility of conductive structures and PCM Minimization of contact resistance between the conductive structures and heat carrier structure (e.g. tube) Thermo-mechanical stress due to density changes of the PCM and long-term stability of the structure Optimization of the geometry of the conductive structure (e.g. avoidance of large physical distances between structure and PCM, minimization of material utilization, suitable interconnection of the structure) An important ratio is the volume fraction of the conductive structure to the total volume (PCM and conductive structure). The volume specific costs of conductive structure should be compared to the volume specific costs of PCM to estimate the acceptable fraction of structure materials. Table 8 shows that aluminum and graphite foil have favorable properties in terms of low volumetric specific costs and a high conductivity. Table 8: Materials for extended surface heat transfer. Material Aluminum Graphite foil Carbon steel Stainless steel Thermal conductivity Density [W/(mK)] [kg/m3] 200 2700 150 1000 30 7800 20 7800 Approx. Vol. spec. material costs [€/m3] 7000 9000 14000 19000PDF Image | Annual Review of Heat Transfer
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