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Inkjet-Printed Ag-Layers on Flexible, Uncoated Paper Substrates

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Inkjet-Printed Ag-Layers on Flexible, Uncoated Paper Substrates ( inkjet-printed-ag-layers-flexible-uncoated-paper-substrates )

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Sensors 2020, 20, 2398 11 of 13 of the individual substrate characteristics (e.g., surface roughness, porosity, fibrousness) on the conductivity as well as the reproducibility have been thoroughly studied and the results were compared to white-heat-stabilised and -treated PET foil for printed electronics. While the resulting sheet resistance on PET substrate appears to be mainly process-dependent and provides a decent reproducibility, the sheet resistance on the paper substrates is highly dependent on the substrate properties, such as the specific porosity and fibrousness. This is because a large amount of the low-viscous inkjet printing ink is absorbed by the substrate, which also leads to an increase in the resulting resistance. Apart from that, the absorption can be advantageous as it improves the adhesion of the printed layer to the substrate. The lowest median specific resistivity value of the sintered Ag-layer on PET substrate was 6.3 μΩ·cm, which corresponds to four times the bulk resistivity of silver. Even on the porous type 4 paper, substrate resistivity values as low as 11.6 μΩ·cm (7.3 × bulk) could be achieved. However, for the highly porous and fibrous type 7 paper substrate, the layer thickness and hence the specific resistivity could not be quantified. Although the resistance values on type 4 and type 7 have proven to be less reproducible than on PET, the results do not necessarily mean that cheap and commercially available uncoated paper substrates are not qualified for the additive manufacturing of sensors. The requirements for the level of reproducibility and conductivity are highly dependent on the individual application. However, the particular properties of the material need to be considered carefully to establish a stable manufacturing process. Author Contributions: Conceptualization, J.Z. and A.R.; methodology, J.Z.; formal analysis, J.Z.; investigation, A.R., L.R.; writing—original draft preparation, J.Z.; writing—review and editing, J.Z., A.R., L.R., C.H.; supervision, C.H.; project administration, C.H.; All authors have read and agreed to the published version of the manuscript. Funding: This work was conducted in the project Flex-Si-Sense (FFG project number: 871336) as part of the FFG program Silicon!Alps. Funding by the Federal Ministries of Climate Action, Environment, Energy, Mobility, Innovation and Technology (BMK) and of Economics and Labour (BMWA), managed on their behalf by the Austrian Research Promotion Agency (FFG), is gratefully acknowledged. In addition, this research was partially funded by the European Regional Development Fund (EFRE), grant number KWF-41 27|30247|43666. Conflicts of Interest: The authors declare no conflict of interest. The funders had no role in the design of the study; in the collection, analyses, or interpretation of data; in the writing of the manuscript, or in the decision to publish the results. References 1. Chang, J.S.; Facchetti, A.F.; Reuss, R. A circuits and systems perspective of organic/printed electronics: Review, challenges, and contemporary and emerging design approaches. IEEE J. Emerg. Sel. Top. Circuits Syst. 2017, 7, 7–26. [CrossRef] 2. Mohammed, M.G.; Kramer, R. All-printed flexible and stretchable electronics. Adv. Mater. 2017, 29, 1604965. [CrossRef] [PubMed] 3. Sreenilayam, S.P.; Ahad, I.U.; Nicolosi, V.; Garzon, V.A.; Brabazon, D. Advanced materials of printed wearables for physiological parameter monitoring. Mater. Today 2010, 32, 147–177. [CrossRef] 4. Wallace, D. Overview of inkjet-based micromanufacturing. In Inkjet-Based Micromanufacturing; WILEY-VCH Verlag GmbH & Co. KGaA: Weinheim, Germany, 2012; pp. 1–17. 5. Das, R. Printing Technologies find their Place in Printed Electronics; IDTechEx: Cambridge, UK, 2017. 6. Tobjörk, D.; Österbacka, R. Paper electronics. Adv. Mater. 2011, 23, 1935–1961. [CrossRef] [PubMed] 7. Zheng, Y.; He, Z.; Gao, Y.; Liu, Y. Direct desktop printed-circuits-on-paper flexible electronics. Sci. Rep. 2013, 3, 1786. [CrossRef] 8. Xie, L.; Mäntysalo, M.; Cabezas, A.L.; Feng, Y.; Jonsson, F.; Zheng, L.-R. Electrical performance and reliability evaluation of inkjet-printed Ag interconnections on paper substrates. Mater. Lett. 2012, 88, 68–72. [CrossRef] 9. Ihalainen, P.; Määttänen, A.; Järnström, J.; Tobjörk, D.; Österbacka, R.; Peltonen, J. Influence of surface properties of coated papers on printed electronics. Ind. Eng. Chem. Res. 2012, 51, 6025–6036. [CrossRef]

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