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Sensors 2020, 20, 1333 7 of 15 Sensors 2019, 19, x FOR PEER REVIEW 7 of 15 the resistance decreases. By increasing the conductor width, a decrease in the standard deviation the resistance decreases. By increasing the conductor width, a decrease in the standard deviation was was observed. This was caused by small defects in the conductor which have a stronger impact on observed. This was caused by small defects in the conductor which have a stronger impact on the the resistance of conductors with smaller widths. By performing a photonic curing after the thermal resistance of conductors with smaller widths. By performing a photonic curing after the thermal sintering, the resistance could be further reduced by about 50%. sintering, the resistance could be further reduced by about 50%. Figure 3. Resistances of printed Au-ink on COC with variation of layer number and sintering parameters. ◦◦ FTihgeurrmeal3s.inRtesrisntgan(1cehs/1o3f0 pCri)n;tCeodmAbiun-aintikonoonf tChOerCmawl sitihntevrainrigatainodnpohfoltaoyneicrcnuurimngbe(1r ha/n13d0siCnt+erPinFg). parameters. Thermal sintering (1h/130 °C); Combination of thermal sintering and photonic curing Under these conditions, minimum specific resistances of 49.9 μΩ cm by thermal sintering and (1h/130 °C + PF). 22.7 μΩ cm by the combination of thermal sintering and photonic curing on COC were reached. ComUpanrdeedrttohbesuelkcognodldit,itohnis,ims tihneim22u.m5-fsopldecsipfieccrifiescisrteasniscteasncoef f4o9r.9thμeΩrmcmallybysinthteremdaellseicnttreordinegs,and 2th2e.71μ0Ω-foclmd sbpyectihfiec rceosmisbtaincaetiofonr othfetrhmeramllyalansidntpehriontgonaincadllyphsionttoenriecdceulericntrgodoens.COC were reached. Compared to bulk gold, this is the 22.5-fold specific resistance for thermally sintered electrodes, and The results of the cross-cut test and the influence of the sintering temperature and the plasma 3.1.3. Adhesion Test the 10-fold specific resistance for thermally and photonically sintered electrodes. 3.1.3. Adhesion Test power on the adhesive strength of the printed structures (6 layers) are shown in Figure 4. For the thermal-sintered Au structures without subsequent photonic curing and a plasma power of 40 W The results of the cross-cut test and the influence of the sintering temperature and the plasma one measurement was carried out. For the remaining values two measurements were carried out, power on the adhesive strength of the printed structures (6 layers) are shown in Figure 4. For the which resulted in the same cross-cut values. With a plasma power of 40 W the adhesive strength of the thermal-sintered Au structures without subsequent photonic curing and a plasma power of 40 W one printed Au structures on COC sintered at 100 ◦C was poor. By increasing the sintering temperature measurement was carried out. For the remaining values two measurements were carried out, which up to 130 ◦C, the adhesive strength has increased significantly with an optimum cross cut value of 0. resulted in the same cross-cut values. With a plasma power of 40 W the adhesive strength of the The same result was reached with a thermal sintering at 130 ◦C and a subsequent photonic curing. printed Au structures on COC sintered at 100 °C was poor. By increasing the sintering temperature However, the structures printed on COC pretreated with 60 W oxygen plasma showed poor adhesive up to 130 °C, the adhesive strength has increased significantly with an optimum cross cut value of 0. strength. The results showed that the adhesive strength can decrease, if the plasma power is too high. The same result was reached with a thermal sintering at 130 °C and a subsequent photonic curing. The best results were reached with a plasma power of 40 W for 20 s and a sintering temperature of However, the structures printed on COC pretreated with 60 W oxygen plasma showed poor adhesive 130 ◦C for 1 h with a subsequent photonic curing. strength. The results showed that the adhesive strength can decrease, if the plasma power is too high. The best results were reached with a plasma power of 40 W for 20 seconds and a sintering temperature of 130 °C for 1 h with a subsequent photonic curing.PDF Image | Inkjet-Printing Nanoparticle Gold Silver Ink Cyclic Olefin
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