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the adsorption time observed after the channel is baked twice. The first baking is performed before the first tests to remove water that may have entered the channel before first use. The second baking corresponds to the test conducted after baking following the first test to assess its repeatability, with the results shown in Figure 4.20. Repetitive baking might affect the bonding of the adsorbent layer, which is coated on the inner wall of the fused silica support layer and may in turn worsen the separation performance. As shown in Figure 4.20, three channels are baked for the second time and a significant drop in adsorption time is observed for each of the cases. The flow conditions are kept the same for these experiments to analyze the effect of baking alone. For instance, for a 2 m long channel with a ΔP of 22 kPa, the adsorption time in the first breakthrough test is 12 s (Solid black line). For the same channel exposed to the same test conditions, the adsorption time in the first breakthrough test decreases to 9.5 s after the second baking. It must be noted that the gradual drop in adsorption time for each test condition is due to water adsorption, which is discussed in connection with Figure 4.3. The decrease in adsorption time is expected to be due to repeated exposure of the test sections to harsh pressure and temperature conditions required for baking, and not chemical softening of the layer. Because PLOT columns and the custom adsorbent-coated channels are fabricated by the solution drying approach, a perfectly annular adsorbent layer with uniform thickness is unlikely. Due to the nonuniform thickness, it is possible that the particles dislodged due to shear at the wall. While reactions of the component gases with the adsorbent are taken into account in the adsorption equilibrium equations, those with the silica binder do not take place at temperatures of 400°C and lower, and pressures of 18 GPa and lower (Santoroa et al., 2011; Wan et al., 2013). The presence of 155PDF Image | TEMPERATURE SWING ADSORPTION PROCESSES FOR GAS SEPARATION
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