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Recycling Printed Circuit Board Wastes Through Supercritical Fluid Delaminating

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Recycling Printed Circuit Board Wastes Through Supercritical Fluid Delaminating ( recycling-printed-circuit-board-wastes-through-supercritical )

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pressure levels when 7 mole % of water is added as environmentally benign co-solvent. The temperature increase from 200 C to 250 C can induce approximately 12-15 % of WRP increase at the three pressure levels, while the WRP increases induced by temperature increase from 150 C to 250 C are in the same magnitude with those by temperature increase from 200 C to 250 C. b) Temperature effect on WRP with 7 mole % H2O added for 6 hour treatment The result is shown in figure 15. The three WRP lines demonstrate slight WRP increase tendencies at the three pressure levels when temperature increases from 150 C to 200 C while rapid large WRP increases happens when temperature increases from 200 C to 250 C with PCB dissolution time set at 6 hours and 7 mole % of water is added as co-solvent in each experiment. Temp effect on WRP with H2O at 6 hr 20.000 15.000 10.000 5.000 0.000 100 150 Temperature (C) 200 250 300 2000 psi 4000 psi 6000 psi Figure 15 Temperature effect on WRP with 7 mole % H2O added for 6 hrs’ treatment The temperature increase data shows that temperature increase from 150 C to 200 C can induce very small increase on WRP at the three pressure levels when 7 mole % of water is added asenvironmentallybenignco-solvent,whilethetemperatureincreasefrom200 Cto250 Ccan induce approximately 12-15 % of WRP increase at the three pressure levels. Temperature increase from 150 C to 250 C can induce a little bit more increase in WRP than those induced by temperature increase from 200 C to 250 C. c) Summary The two group studies states that the PCB dissolution in SCF CO2 with 7 mole % of water added is highly correlated with temperature factor when it is above 200 C while pressure and time is set at their effective conditions. When temperature is increased in the range between 150 C and 200 C, the PCB dissolution is increased slightly with temperature increase; when temperature is increased in the range between 200 C and 250 C, the PCB dissolution is increased rapidly by dozens of percent magnitude. The big WRP increases between 200 C and 250 C are also resulted from a combination of temperature effect and oxidization effect. From previous studies, it is stated that higher temperature induced bigger WRP increase, while existence of oxygen and addition of 7 mole % of water to the PCB dissolution process may catalyze the oxidization of PCB polymers in SCF CO2 treatment, which will cause degradation of PCB polymeric materials and hence enlarge the WRP increase at 250 C. 19 Weight loss (%)

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