Recycling Printed Circuit Board Wastes Through Supercritical Fluid Delaminating

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Recycling Printed Circuit Board Wastes Through Supercritical Fluid Delaminating ( recycling-printed-circuit-board-wastes-through-supercritical )

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Comparison on WRP The WRP increase percent are compared between the result from pure SCF CO2 treatment and the result from SCF CO2 treatment with 7 mole % of H2O added as co-solvent, to analyze the H2O co-solvent effect on PCB dissolution in SCF CO2. The WRP comparisons are set into two groups based on the two time levels. a) WRP comparison for H2O co-solvent effect with 3 hour treatment The WRP comparison is conducted through analysis on the WRP differences at the same pressure and temperature conditions when time is given for 3 hours for interaction between PCB resins and SCF CO2. The data are calculated by subtracting the averaged WRP data at each test in pure SCF CO2 treatment from the averaged WRP data at the corresponding test in SCF CO2 plus 7 mole % of water. The WRP difference is shown in figure 19 and figure 20, respectively, based on the three pressure and temperature study levels. The lines in figure 19 and 20, respectively, represent the trends of WRP differences with pressure and temperature changes. Figure 19 describes the pressure change effect on WRP difference between the PCBs treated in pure SCF CO2 and PCBs treated in SCF CO2 plus 7 mole % of H2O when time is given for 3 hours for the interactions between various PCB resins and SCF CO2. The trend line is regressed with a slope of 7 x 10-5 and an intercept of 0.4084 percent, which demonstrate a negligible effect of pressure change on WRP differences between the PCB specimen treated in pure SCF CO2 and PCB specimen treated in SCF CO2 plus 7 mole % of water. WRP difference for co-solvent effect at 3 hrs 2 1.5 1 0.5 0 y = 0.00007x + 0.4084 0 2000 4000 6000 8000 Pressure (psi) 150 C 200 C 250 C Linear (Mean) Figure 19 WRP difference by pressure change at 3 hrs Figure 20 describes the temperature change effect on WRP difference between the PCBs treated in pure SCF CO2 and PCBs treated in SCF CO2 plus 7 mole % of H2O as co-solvent when time is given for 3 hours for the interactions between various PCB resins and SCF CO2. In the figure, the trend line is regressed with a slope of 3.3 x 10-3 and an intercept of 0.0274 percent, which demonstrate a small increase effect of temperature change on WRP differences between the PCB specimen treated in pure SCF CO2 and PCB specimen treated in SCF CO2 plus 7 mole % of water. The trend line shows that at the same time level, temperature factor is about 47 times more important than pressure factor for the co-solvent enhancement effect on solubility of various PCB resins in SCF CO2. 22 WRP Difference (%)

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