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Metal Extraction Processes for Electronic Waste

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Metal Extraction Processes for Electronic Waste ( metal-extraction-processes-electronic-waste )

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Resources 2014, 3 176 12. Li,J.;Xu,Z.;Zhou,Y.Applicationofcoronadischargeandelectrostaticforcetoseparatemetals and nonmetals from crushed particles of waste printed circuit boards. J. Electrost. 2007, 65, 233–238. 13. Lu, H.; Li, J.; Guo, J.; Xu, Z. Movement behavior in electrostatic separation: Recycling of metal materials from waste printed circuit board. J. Mater. Process. Technol. 2008, 197, 101–108. 14. Yamane, L.H.; de Moraes, V.T.; Espinosa, D.C.; Tenório, J.A. Recycling of WEEE: Characterization of spent printed circuit boards from mobile phones and computers. Waste Manag. 2011, 31, 2553–2558. 15. Guo,J.;Xu,Z.Recyclingofnon-metallicfractionsfromwasteprintedcircuitboards:Areview. J. Hazard. Mater. 2009, 168, 567–590. 16. Shuey,S.A.;Taylor,P.AReviewofPyrometallurgicalTreatmentofElectronicScrap.InProceedings of the SME Annual Meeting, Denver, CO, USA, 23–25 February 2004. 17. Kim, B.S.; Lee, J.C.; Seo, S.P.; Park, Y.K.; Sohn, H.Y. A process for extracting precious metals from spent printed circuit boards and automobile catalysts. JOM 2004, 56, 55–58. 18. Iji, M.; Yokoyama, S. Recycling of printed wiring boards with mounted electronic components. Circuit World 1997, 23, 10–15. 19. The Composition of Valuable Substances in E-Waste. Available online: http://ewasteguide.info (accessed on 19 November 2013). 20. Hagelüken, C. Improving Metal Returns and Eco-Efficiency in Electronics Recycling—A Holistic Approach for Interface Optimisation between Pre-Processing and Integrated Metals Smelting and Refining. In Proceedings of the IEEE International Symposium on Electronics and the Environment, Scottsdale, AZ, USA, 8–11 May 2006. 21. Cui,J.;Forssberg,E.Mechanicalrecyclingofwasteelectricandelectronicequipment:Areview. J. Hazard. Mater. 2003, 99, 243–263. 22. Office of Solid Waste. Electronic Waste Management in the United States—Approach 1; U.S Environmental Protection Agency: Washington, DC, USA, 2008; p. 56. 23. Widmer,R.;Oswald-Krapf,H.;Sinha-Khetriwal,D.;Schnellmann,M.;Böni,H.Globalperspectives on e-waste. Environ. Impact Assess. Rev. 2005, 25, 436–458. 24. Kang, H.-Y.; Schoenung, J.M. Electronic waste recycling: A review of U.S. infrastructure and technology options. Resour. Conserv. Recycl. 2005, 45, 368–400. 25. Kahhat,R.;Kim,J.;Xu,M.;Allenby,B.;Williams,E.;Zhang,P.Exploringe-wastemanagement systems in the United States. Resour. Conserv. Recycl. 2008, 52, 955–964. 26. Lee, J.-C.; Song, H.T.; Yoo, J.-M. Present status of the recycling of waste electrical and electronic equipment in Korea. Resour. Conserv. Recycl. 2007, 50, 380–397. 27. Huang, K.; Guo, J.; Xu, Z. Recycling of waste printed circuit boards: A review of current technologies and treatment status in China. J. Hazard. Mater. 2009, 164, 399–408. 28. Hischier,R.;Wäger,P.;Gauglhofer,J.DoesWEEErecyclingmakesensefromanenvironmental perspective?: The environmental impacts of the Swiss take-back and recycling systems for waste electrical and electronic equipment (WEEE). Environ. Impact Assess. Rev. 2005, 25, 525–539. 29. Dalrymple, I.; Wright, N.; Kellner, R.; Bains, N.; Geraghty, K.; Goosey, M.; Lightfoot, L. An integrated approach to electronic waste (WEEE) recycling. Circuit World 2007, 33, 52–58. 30. Institute of Scrap Recycling Industries (ISRI). Scrap Recycling: Where Tomorrow Begins; ISRI: Washington, DC, USA, 2003; pp. 16–24.

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