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3. FILM CHARACTERIZATION Figure 3.6: Macroscopic elemental distribution and thickness of S- 24AOw thin film - Calculated from XRF and visualized by estimation and ap- proximation by nearest neighbours. Distribution of nickel, samarium and chromium element is shown. Additionally Ni:Sm atomic ratio and sample thickness distribu- tion as well. The sample as seen on XRF camera and analysis area defined in red rectangle in the first image. however, for NiO, a small gradient in concentration is evidenced (figure 3.7). The amount of chromium oxide is close to zero at the film’s surface. Again, there is some thickness variation, however, it is limited to the edge of the sample. The S-42Aw sample deposited in pure argon plasma had been exposed to high temperature and high pressure of oxygen which affected the film stability. The sample after deposition nor after 38-hour annealing did not show any signs of damage, surface discontinuities or sharp changes of structure or colour. However subsequent experiments in high vacuum caused partial defragmentation of the film. A closer look under the microscope reveals a puzzle-like structure with the surface being formed of little polygons 3.8. These are parts of the defragmented film. The closer to the film interior, the further away the polygons are of each other. The closer to the film edge, the film becomes more continuous and is more coherent. Also, every uncommon part of the surface is a source of film damage. For example, the film is more damaged around capillary and bubbles. A possible explanation for that would be the film is too thick and has too low density in order to stabilize the structure and adhesion to the highly mismatched substrate. It is worth noting that although silicon wafers were used as a substrate, most 68PDF Image | Investigation of metal-insulator transition in magnetron sputtered samarium nickelate thin films
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